產(chǎn)品簡介 Produsts Introduction
本機(jī)型是我公司針對大尺寸晶圓及晶環(huán)切割需求設(shè)計(jì)的一款專用機(jī)型。它的推出滿足了客戶對大尺寸晶
圓加工的更高要求,在保證了高精度、高可靠性的前提下,實(shí)現(xiàn)了加工效率的顯著提升。
This series is a special machine designed for large size wafer and crystal ring cutting needs.The
machining efficiency is improved with a high-precision.
切割樣品 Cutting sample
機(jī)型特點(diǎn) Characteristics
技術(shù)參數(shù) Parameter