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LCP日本東麗 Siveras L304X35Z-BH 相關產品介紹,應用如下:
Ⅱ. Warpage after reflow soldering
LCP resin is used in SMT connectors mounted on IC circuit boards.
When the connector is mounted, there is a step where heat is applied to melt soldering (reflow step). Warpage occurs as a result of this step.
Warpage after reflow is caused by the relaxation of residual stress in the molded product. That relaxation is caused by exposure to the heat used in the reflow step.
SIVERAS? exhibits better flowability than competitor LCPs. That makes it possible to use lower peak pressure during injection-molding, which in turn results in less residual stress and a lower probability of warpage resulting from the reflow step.
Examples of pressure waves during injection-molding of LCP